
Material Technology_ QB-M1
Quiz by Kashif Adnan
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30 questions
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- Q1Which of the following is NOT a category of engineering materials?PolymersCeramicsMetals and AlloysOrganic Compounds60s
- Q2What is the primary reason for using plastic in the outer casing of an electrical connector?Good electrical insulationHigh strengthHigh electrical conductivityHigh thermal conductivity60s
- Q3Which material is commonly used for electrical conductor wires due to its high electrical conductivity?AluminumBrassCopperSilver60s
- Q4What is the main reason for selecting brass in the metal joining piece of an electrical connector?Good electrical conductivity and ease of machiningHigh costHigh thermal insulationHigh brittleness60s
- Q5Which of the following is an example of a ceramic material?SiO₂-Na₂O-CaO (Window glass)SiliconBrassPolyethylene60s
- Q6What is the primary use of barium titanate in engineering applications?Thermal insulationElectrical insulationCapacitors for microelectronicsStructural components60s
- Q7Which of the following materials is used in optical fibers for information technology?Aluminum oxideBrassSilicaPolyethylene60s
- Q8What is the primary reason for using polyethylene in food packaging?High strengthEasily formed into thin, flexible, airtight filmHigh electrical conductivityHigh thermal conductivity60s
- Q9Which of the following is a property of metals and alloys?High electrical and thermal conductivityLow ductilityLow strengthHigh brittleness60s
- Q10What is the primary reason for using alloy steels in automobile chassis?High thermal insulationLow costHigh brittlenessSignificant strengthening by heat treatment60s
- Q11Which of the following is an example of a composite material?PolyethyleneGraphite-epoxySiliconBrass60s
- Q12What is the primary advantage of using composite materials?Lightweight and strongLow thermal conductivityHigh costHigh brittleness60s
- Q13Which of the following is a semiconductor material?PolyethyleneBrassAluminumSilicon60s
- Q14What is the primary use of semiconductors in modern technology?Structural componentsElectrical insulationThermal insulationTransistors and integrated circuits60s
- Q15Which of the following is a property of ceramics?High ductilityHigh strength under compressionHigh electrical conductivityHigh thermal conductivity60s