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QUIZ-2-20251

Quiz by Mustajab Abbasi

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20 questions
Show answers
  • Q1
    Metallic bonding occurs mainly in:
    Pure metals and alloys
    Gases
    Ceramics
    Polymers
    30s
  • Q2
    Covalent bonds are formed by:
    Transfer of electrons
    Free movement of electrons
    Attraction of ions
    Sharing of electrons
    30s
  • Q3
    Materials with covalent bonding generally have:
    High electrical conductivity
    High ductility
    High hardness and low electrical conductivity
    Low hardness
    30s
  • Q4
    Ionic bonds form when:
    Atoms share electrons
    Atoms are already bonded
    Atoms lose and gain electrons
    Electrons form a cloud
    30s
  • Q5
    Copper is used in electrical cables mainly because it has:
    Very good electrical conductivity
    High melting point
    Poor thermal conductivity
    High brittleness
    30s
  • Q6
    Materials that melt at very high temperatures are called:
    Ductile materials
    Insulators
    Elastic materials
    Refractory materials
    30s
  • Q7
    Toughness refers to a material’s ability to:
    Bend without breaking
    Return to its original shape
    Resist scratches
    Melt easily
    30s
  • Q8
    A very stiff material will:
    Not deflect much under load
    Have low strength
    Break easily
    Deflect easily
    30s
  • Q9
    Covalent bonds are formed by:
    Free movement of electrons
    Transfer of electrons
    Attraction of ions
    Sharing of electrons
    30s
  • Q10
    Materials with covalent bonding generally have:
    High hardness and low electrical conductivity
    High ductility
    Low hardness
    High electrical conductivity
    30s
  • Q11
    Ionic bonds form when:
    Atoms lose and gain electrons
    Atoms share electrons
    Atoms are already bonded
    Electrons form a cloud
    30s
  • Q12
    Density is defined as:
    Mass per unit volume
    Force per volume
    Weight per area
    Volume per mass
    30s
  • Q13
    A material with high thermal conductivity will:
    Melt at low temperature
    Be a good insulator
    Resist heat flow
    Transfer heat easily
    30s
  • Q14
    Metallic bonding primarily occurs in which type of materials?
    Pure metals and alloys
    Gases
    Ceramics
    Polymers
    30s
  • Q15
    What is responsible for the good electrical and thermal conductivity in metallic bonding?
    Poor conductivity
    Electron cloud
    High brittleness
    High melting point only
    30s

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